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Patent Assignment Details
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Reel/Frame:014927/0288   Pages: 2
Recorded: 07/31/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/28/2006
Application #:
10830070
Filing Dt:
04/23/2004
Publication #:
Pub Dt:
11/18/2004
Title:
DIE FOR MOLDING DISC SUBSTRATES
Assignor
1
Exec Dt:
03/16/2004
Assignee
1
2, OHNE, KITASAKI-CHO, OHBU-SHI
AICHI-KEN, JAPAN 474
Correspondence name and address
BROWDY AND NEIMARK, PLLC
624 NINTH STREET, NW
SUITE 300
WASHINGTON, DC 20001-5303

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