Patent Assignment Details
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Reel/Frame: | 014711/0289 | |
| Pages: | 3 |
| | Recorded: | 11/17/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10714794
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Filing Dt:
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11/17/2003
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH EMBEDDED METAL PILLAR
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Assignee
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3RD FLOOR, 157 LI-TE ROAD |
PEITOU DISTRICT, TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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2440 ANDREW DRIVE
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SUPERIOR, COLORADO 80027
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