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Reel/Frame:024947/0289   Pages: 11
Recorded: 09/07/2010
Attorney Dkt #:022411-1112
Conveyance: SECURITY AGREEMENT
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12796520
Filing Dt:
06/08/2010
Publication #:
Pub Dt:
01/13/2011
Title:
Support Layer for Thin Copper Foil
Assignor
1
Exec Dt:
08/18/2010
Assignee
1
30 HUDSON STREET
36TH FLOOR
JERSEY CITY, NEW JERSEY 07302
Correspondence name and address
ANGELA M. AMARU C/O LATHAM & WATKINS
885 THIRD AVENUE
SUITE 1000
NEW YORK, NY 10022

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