Patent Assignment Details
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| Reel/Frame: | 057760/0289 | |
| Pages: | 3 |
| | Recorded: | 10/12/2021 | | |
| Attorney Dkt #: | 2867-2480C |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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17498821
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Filing Dt:
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10/12/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Title:
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SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION AND METHODS OF FORMING THE SAME
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Assignee
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| 7628 THORNDIKE ROAD |
| GREENSBORO, NORTH CAROLINA 27409 |
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Correspondence name and address
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QORVO AND WITHROW & TERRANOVA, P.L.L.C.
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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