Patent Assignment Details
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Reel/Frame: | 064495/0292 | |
| Pages: | 6 |
| | Recorded: | 08/04/2023 | | |
Attorney Dkt #: | 21728.067US-DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18364314
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Filing Dt:
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08/02/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Title:
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FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS
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Assignee
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7855 SOUTH RIVER PARKWAY |
SUITE 205 |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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RILEE THERIAULT
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1255 W RIO SALADO PKWY
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SUITE 215
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TEMPE, AZ 85281
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06/21/2024 04:57 AM
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