Patent Assignment Details
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| Reel/Frame: | 012055/0296 | |
| Pages: | 3 |
| | Recorded: | 08/06/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09849629
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Filing Dt:
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05/04/2001
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Publication #:
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Pub Dt:
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12/06/2001
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Title:
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HIGHLY CONDUCTIVE MOLDING COMPOUNDS FOR USE AS FUEL CELL PLATES AND THE RESULTING PRODUCTS
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Assignee
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| P.O. BOX 281 RT. 20 & HARMON ROAD |
| N. KINGSVILLE, OHIO 44068 |
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Correspondence name and address
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HUDAK & SHUNK CO., L.P.A.
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LAURA F. SHUNK
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7 WEST BOWERY STREET
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SUITE 808
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AKRON OH 44308
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