Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 021778/0297 | |
| Pages: | 7 |
| | Recorded: | 11/03/2008 | | |
Attorney Dkt #: | MA105-023 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
12131788
|
Filing Dt:
|
06/02/2008
|
Publication #:
|
|
Pub Dt:
|
12/03/2009
| | | | |
Title:
|
BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
|
|
Assignee
|
|
|
3RD FLOOR, BIO-INFORMATICS CENTRE |
2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK |
SHATIN, NEW TERRITORIES, HONG KONG |
|
Correspondence name and address
|
|
JAMES D. SHAURETTE
|
|
WELLS ST. JOHN, P.S.
|
|
601 W. 1ST AVE., #1300
|
|
SPOKANE, WA 99201
|
Search Results as of:
09/22/2024 10:10 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|