Patent Assignment Details
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Reel/Frame: | 033216/0299 | |
| Pages: | 3 |
| | Recorded: | 06/30/2014 | | |
Attorney Dkt #: | 4887P1159 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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14320426
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Filing Dt:
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06/30/2014
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Title:
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WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH WITH MASK APPLICATION BY VACUUM LAMINATION
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Assignee
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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JUSTIN K. BRASK
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1925 NW AMBERGLEN PARKWAY
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SUITE 230
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BEAVERTON, OR 97006
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