Patent Assignment Details
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Reel/Frame: | 016759/0301 | |
| Pages: | 3 |
| | Recorded: | 11/09/2005 | | |
Attorney Dkt #: | 27-109 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11164087
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Filing Dt:
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11/09/2005
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING RIBBON BOND INTERCONNECT
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA ROAD
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SUITE A1
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SUNNYVALE, CA 94087
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