Patent Assignment Details
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Reel/Frame: | 016938/0301 | |
| Pages: | 4 |
| | Recorded: | 08/25/2005 | | |
Attorney Dkt #: | CM08367K |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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11213200
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Filing Dt:
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08/25/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Title:
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HEAT SINK PACKAGING ASSEMBLY FOR ELECTRONIC COMPONENTS
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Assignee
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1303 E. ALGONQUIN ROAD |
LAW DEPARTMENT, IL01 - 3RD FLOOR |
SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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8000 WEST SUNRISE BOULEVARD
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LAW DEPT. - MD1610
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PLANTATION, FLORIDA 33322
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