Patent Assignment Details
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Reel/Frame: | 017455/0301 | |
| Pages: | 3 |
| | Recorded: | 04/11/2006 | | |
Attorney Dkt #: | 9898-478 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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11279344
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Filing Dt:
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04/11/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNOSN & MCCOLLOM, P.C.
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210 SW MORRISON STREET, SUITE 400
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PORTLAND, OR 97204
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