Patent Assignment Details
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| Reel/Frame: | 017394/0302 | |
| Pages: | 3 |
| | Recorded: | 03/28/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/04/2007
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Application #:
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11245962
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Filing Dt:
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10/07/2005
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Publication #:
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Pub Dt:
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04/13/2006
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Title:
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METHOD FOR MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE USING REDISTRIBUTION SUBSTRATE
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Assignee
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| ROOM 504, INSAGWAN, KANGNAM UNIVERSITY SAN 6-2, KUGALRI, KIHEUNGUB |
| YONGIN-SI, KYOUNGKI-DO 449-702, KOREA, REPUBLIC OF |
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Correspondence name and address
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MICHAEL J. HUGHES
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INTELLECTUAL PROPERTY LAW OFFICES
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1901 S. BASCOM AVE., SUITE 660
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CAMPBELL, CA 95008
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