Patent Assignment Details
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Reel/Frame: | 004280/0306 | |
| Pages: | 2 |
| | Recorded: | 06/28/1984 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/16/1986
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Application #:
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06625386
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Filing Dt:
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06/28/1984
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Title:
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PROCESS FOR FORMING IMPROVED SOLDER CONNECTIONS FOR SEMICONDUCTOR DEVICES WITH ENHANCED FATIGUE LIFE
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Assignee
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A NY CORP. |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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WOLMAR J. STOFFEL
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IBM CORP. DEPT., 901 BLDG. 300/482
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HOPEWELL JUNCTION, NY 12533-9988
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