Patent Assignment Details
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| Reel/Frame: | 055567/0306 | |
| Pages: | 4 |
| | Recorded: | 03/11/2021 | | |
| Attorney Dkt #: | T1516.10483US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17199066
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Filing Dt:
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03/11/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Title:
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DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MASCHOFF BRENNAN
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1389 CENTER DRIVE, SUITE 300
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PARK CITY, UT 84098
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05/28/2024 06:42 PM
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