Patent Assignment Details
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Reel/Frame: | 056893/0306 | |
| Pages: | 7 |
| | Recorded: | 07/16/2021 | | |
Attorney Dkt #: | TSMP20201911US01 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 056802 FRAME: 0908. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17371556
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Filing Dt:
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07/09/2021
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Title:
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Via-First Self-Aligned Interconnect Formation Process
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Assignee
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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05/30/2024 12:39 AM
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