Patent Assignment Details
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Reel/Frame: | 042646/0307 | |
| Pages: | 3 |
| | Recorded: | 06/08/2017 | | |
Attorney Dkt #: | PS170047CYH |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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15617126
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Filing Dt:
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06/08/2017
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Publication #:
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Pub Dt:
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02/08/2018
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Title:
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SEMICONDUCTOR CHIP PACKAGE HAVING HEAT DISSIPATING STRUCTURE
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Assignee
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102, GILJU-RO 425BEON-GIL, WONMI-GU, GYEONGGI-DO |
BUCHEON-SI, KOREA, REPUBLIC OF 14487 |
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Correspondence name and address
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KORUS PATENT, LLC (ATTN: SEONG IL JEONG)
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3333 WARRENVILLE RD., SUITE 200
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LISLE, IL 60532
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