Patent Assignment Details
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| Reel/Frame: | 021975/0308 | |
| Pages: | 4 |
| | Recorded: | 12/11/2008 | | |
| Attorney Dkt #: | JCLA28425 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12333014
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Filing Dt:
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12/11/2008
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Publication #:
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Pub Dt:
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04/15/2010
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Title:
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MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO. 38, HSING PONG RD. |
| KWEI-SAN INDUSTRIAL EXENDER ZONE |
| TAOYUAN, TAIWAN R.O.C. |
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Correspondence name and address
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J. C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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