Patent Assignment Details
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| Reel/Frame: | 050007/0311 | |
| Pages: | 4 |
| | Recorded: | 08/08/2019 | | |
| Attorney Dkt #: | OP-108000020 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16536289
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Filing Dt:
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08/08/2019
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Publication #:
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Pub Dt:
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10/29/2020
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Title:
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MOLDED HEAT TRANSFER COMPONENT HAVING VAPOR CHAMBER AND MOLDING METHOD THEREOF
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Assignee
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| 9F.-3, NO.32, SEC. 1, CHENGGONG RD., NANGANG DIST. |
| TAIPEI CITY, TAIWAN 115 |
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Correspondence name and address
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HDLS IPR SERVICES
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P.O. BOX 230970
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CENTREVILLE, VA 20120
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06/20/2024 02:06 PM
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