Patent Assignment Details
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| Reel/Frame: | 058158/0311 | |
| Pages: | 2 |
| | Recorded: | 11/19/2021 | | |
| Attorney Dkt #: | CLOUD-21007-USPT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17530449
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Filing Dt:
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11/18/2021
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Title:
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ARCHITECTURE FOR CHIP-TO-CHIP INTERCONNECTION IN SEMICONDUCTORS
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Assignee
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| UNITS 1515-1519, 15/F BUILDING 19W, 19 SCIENCE PARK WEST AVENUE, PAK SHEK KOK, N.T. |
| HONG KONG, HONG KONG |
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Correspondence name and address
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BYIP LTD.
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5700 GRANITE PARKWAY, SUITE 200
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PLANO, TX 75024
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05/31/2024 07:29 PM
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