Patent Assignment Details
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Reel/Frame: | 006009/0312 | |
| Pages: | 3 |
| | Recorded: | 01/29/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/02/1996
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Application #:
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07827657
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Filing Dt:
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01/29/1992
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Title:
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I/O PAD ADHESION LAYER FOR A CERAMIC SUBSTRATE
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Correspondence name and address
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IBM CORPORATION
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DEPT. 901, BLDG. 300-482
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HOPEWELL JUNCTION, NEW YORK 12533
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