Patent Assignment Details
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Reel/Frame: | 006180/0312 | |
| Pages: | 3 |
| | Recorded: | 06/15/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/28/1993
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Application #:
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07898646
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Filing Dt:
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06/15/1992
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Title:
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MULTIPLE CHIP PACKAGE WITH THINNED SEMICONDUCTOR CHIPS
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Assignee
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A CORP. OF DE |
SCHAUMBURG, ILLINOIS |
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Correspondence name and address
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HARRY A. WOLIN
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MOTOROLA, INC.
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4250 E. CAMELBACK ROAD, SUITE 300K
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PHOENIX, AZ 85018
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