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Reel/Frame:062926/0312   Pages: 14
Recorded: 03/02/2023
Attorney Dkt #:J6982-2111
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S DATA PREVIOUSLY RECORDED ON REEL 062834 FRAME 0065. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18005608
Filing Dt:
01/15/2023
Publication #:
US20230326765
Pub Dt:
10/12/2023
Title:
PACKAGE SUBSTRATE MANUFACTURING METHOD
Assignors
1
CHEN, XIANMING
Exec Dt:
01/13/2023
2
BURMEISTER, FRANK
Exec Dt:
02/01/2023
3
FENG, LEI
Exec Dt:
01/11/2023
4
ZHAO, YUJUN
Exec Dt:
01/30/2023
5
HUANG, BENXIA
Exec Dt:
01/11/2023
6
YI, JINXIN
Exec Dt:
01/17/2023
7
FENG, JINDONG
Exec Dt:
01/11/2023
8
LI, YUAN
Exec Dt:
01/17/2023
9
JIANG, LINA
Exec Dt:
01/11/2023
10
TENA, EDWARD
Exec Dt:
01/18/2023
11
WANG, WENSHI
Exec Dt:
01/11/2023
Assignees
1
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
FPC FACTORY, NO. 3209, NORTH ZHUFENG
DOUMEN, ZHUHAI
GUANGDONG, CHINA 519175
2
NEXPERIA B.V.
JONKERBOSPLEIN 52
NIJMEGEN, NETHERLANDS 6534 AB
Correspondence name and address
BUCHALTER
1000 WILSHIRE BOULEVARD
SUITE 1500
LOS ANGELES, CA 90017

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