Patent Assignment Details
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Reel/Frame: | 058683/0314 | |
| Pages: | 3 |
| | Recorded: | 01/10/2022 | | |
Attorney Dkt #: | JOHNSON 21063AI095 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17613762
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Filing Dt:
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11/23/2021
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Publication #:
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Pub Dt:
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07/21/2022
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Title:
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PATTERNED SUBSTRATE, EPITAXIAL WAFER, MANUFACTURING METHOD, STORAGE MEDIUM AND LED CHIP
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Assignee
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15-24/F, KONKA R&D BUILDING, NO. 28 KEJI SOUTH 12TH ROAD, |
SCIENCE AND TECHNOLOGY PARK, YUEHAI SUBDISTRICT, NANSHAN DISTRICT, SHENZHEN |
GUANGDONG, CHINA 518057 |
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Correspondence name and address
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DANIEL H. LANDAU
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4640 E SKYLINE DRIVE
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TUCSON, AZ 85718
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