Patent Assignment Details
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Reel/Frame: | 047113/0316 | |
| Pages: | 5 |
| | Recorded: | 09/20/2018 | | |
Attorney Dkt #: | JUNHP0106WOUS |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16084611
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Filing Dt:
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09/13/2018
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Publication #:
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Pub Dt:
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03/14/2019
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PCT #:
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CN2016076233
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Title:
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CHIP PACKAGING APPARATUS AND METHOD THEREOF
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Assignee
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ROOM 1101, 11/F, 299QRC |
299 QUEEN'S ROAD CENTRAL |
HONG KONG, CHINA |
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Correspondence name and address
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HEIDI A. BOEHLEFELD, ESQ.
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1621 EUCLID AVENUE
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NINETEENTH FLOOR
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CLEVELAND, OH 44115
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