Patent Assignment Details
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| Reel/Frame: | 032832/0317 | |
| Pages: | 2 |
| | Recorded: | 05/06/2014 | | |
| Attorney Dkt #: | 19919.004US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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14261281
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Filing Dt:
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04/24/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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SEMICONDUCTOR WAFER CHUCK AND METHOD
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Assignee
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| 219 E. 50TH ST. |
| BOISE, IDAHO 83714 |
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Correspondence name and address
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PARSONS BEHLE & LATIMER
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800 W. MAIN STREET, SUITE 1300
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ATTN: DOCKETING
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BOISE, ID 83702
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