Patent Assignment Details
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| Reel/Frame: | 008317/0318 | |
| Pages: | 2 |
| | Recorded: | 11/18/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08751615
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Filing Dt:
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11/18/1996
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR CHIP ADHESIVELY BONDED THERETO
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Assignee
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| CHOONGCHEONGBUK-DO |
| 1, HYANGIEONG-DONG, HUNGDUK-GU, CHEONGJU |
| KOREA, REPUBLIC OF 360-4 |
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Correspondence name and address
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FLESHNER & KIM
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DANIEL Y.J. KIM
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8229 BOONE BOULEVARD, SUITE 840
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VIENNA, VA 22182
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