Patent Assignment Details
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Reel/Frame: | 016535/0320 | |
| Pages: | 3 |
| | Recorded: | 05/02/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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11120841
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Filing Dt:
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05/02/2005
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Title:
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REDUCED STRESS UNDER BUMP METALLIZATION STRUCTURE
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER WEAVER & THOMAS LLP
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P.O. BOX 70250
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OAKLAND, CA 94612-0250
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