Patent Assignment Details
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Reel/Frame: | 023829/0320 | |
| Pages: | 2 |
| | Recorded: | 01/21/2010 | | |
Attorney Dkt #: | 074077-0074 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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12691675
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Filing Dt:
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01/21/2010
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Title:
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MULTI-LAYER HIGH-SPEED INTEGRATED CIRCUIT BALL GRID ARRAY PACKAGE AND PROCESS
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Assignee
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200 FLYNN ROAD |
CAMARILLO, CALIFORNIA 93012 |
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Correspondence name and address
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SOYEON (KAREN) PAK LAUB
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MCDERMOTT WILL & EMERY LLP
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18191 VON KARMAN AVE., SUITE 500
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IRVINE, CA 92612-7108
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