Patent Assignment Details
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Reel/Frame: | 008162/0321 | |
| Pages: | 15 |
| | Recorded: | 06/17/1996 | | |
Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/1988
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Application #:
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06940328
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Filing Dt:
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12/11/1986
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Title:
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CONTROL APPARATUS FOR REDUCING ADHESIVE FORCE OF ADHESIVE AGENT ADHERING BETWEEN SEMICONDUCTOR WAFER AND SUBSTRATE
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Assignee
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NO. 23-23 HON-CHO, ITABASHI-KU |
TOKYO, JAPAN |
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Correspondence name and address
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ARMSTRONG, WESTERMAN, HATTORI, ET AL.
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LE-NHUNG MCLELAND
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SUITE 1000
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1725 K STREET, N.W.
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WASHINGTON, D.C. 20006
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