Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065767/0321 | |
| Pages: | 4 |
| | Recorded: | 12/05/2023 | | |
| Attorney Dkt #: | B-10905PCT 633380-9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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17615099
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Filing Dt:
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11/30/2021
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Publication #:
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Pub Dt:
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07/14/2022
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Title:
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HEAT DISSIPATING SUBSTRATE FOR SEMICONDUCTOR AND PREPARATION METHOD THEREOF
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Assignee
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| #308, KOREA INDUSTRIAL COMPLEX CORP. 107, JIWON-RO, DANWON-GU, ANSAN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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LADAS & PARRY LLP
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4525 WILSHIRE BLVD. SUITE 240
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LOS ANGELES, CA 90010
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