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Patent Assignment Details
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Reel/Frame:010915/0322   Pages: 2
Recorded: 07/06/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/10/2001
Application #:
09610858
Filing Dt:
07/06/2000
Title:
Method of making stacked chip package
Assignors
1
Exec Dt:
05/14/2000
2
Exec Dt:
05/14/2000
Assignee
1
NANTZE EXPORT PROCESSING ZONE
NO. 26, CHIN 3RD ROAD
KAOHSHIUNG,, TAIWAN R.O.C
Correspondence name and address
REED SMITH HAZEL THOMAS LLP
STANLEY P. FISHER
3110 FAIRVIEW PARK DR.
SUITE 1400
FALLS CHURCH, VA 22042

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