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Patent Assignment Details
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Reel/Frame:015709/0324   Pages: 4
Recorded: 08/19/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/07/2006
Application #:
10922280
Filing Dt:
08/19/2004
Title:
SEMICONDUCTOR CHIP ASSEMBLY WITH EMBEDDED METAL PARTICLE
Assignors
1
Exec Dt:
08/16/2004
2
Exec Dt:
08/17/2004
Assignee
1
3RD FLOOR, 157 LI-TE ROAD
PEITOU DISTRICT, TAIPEI, TAIWAN 112
Correspondence name and address
DAVID M. SIGMOND
2440 ANDREW DRIVE
SUPERIOR, CO 80027

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