Patent Assignment Details
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Reel/Frame: | 011498/0325 | |
| Pages: | 2 |
| | Recorded: | 01/24/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09767904
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Filing Dt:
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01/24/2001
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Publication #:
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Pub Dt:
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07/25/2002
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Title:
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Chip scale package and manufacturing method thereof
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Assignee
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NANTZE EXPORT PROCESSING ZONE, KAOSHIUNG |
NO. 26, CHIN 3RD ROAD |
TAIWAN, CHINA |
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Correspondence name and address
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DYKEMA GOSSETT PLLC
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RICHARD H. TUSHIN, ESQ.
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FRANKLIN SQUARE, THIRD FLOOR WEST
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3353
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