Patent Assignment Details
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Reel/Frame: | 022103/0325 | |
| Pages: | 2 |
| | Recorded: | 01/13/2009 | | |
Attorney Dkt #: | LOUIS3.002AUS |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12340405
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Filing Dt:
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12/19/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT
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Assignee
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NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN (R.O.C.) |
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Correspondence name and address
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KNOBBE, MARTENS, OLSON & BEAR, LLP
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2040 MAIN STREET, 14TH FLOOR
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IRVINE, CA 92614
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