Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 058113/0325 | |
| Pages: | 15 |
| | Recorded: | 11/15/2021 | | |
Attorney Dkt #: | MR1035-2838 |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10261796
|
Filing Dt:
|
09/30/2002
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
Title:
|
MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
|
|
Assignee
|
|
|
(300) NO. 2, LI-HSIN 3RD RD. |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
|
Correspondence name and address
|
|
ROSENBERG, KLEIN & LEE
|
|
3458 ELLICOTT CENTER DRIVE, SUITE 101
|
|
ELLICOTT CITY, MD 21043
|
Search Results as of:
06/20/2024 03:40 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|