Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066137/0326 | |
| Pages: | 10 |
| | Recorded: | 01/16/2024 | | |
| Attorney Dkt #: | 27305US02-06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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06/26/2012
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Application #:
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12931326
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Filing Dt:
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01/27/2011
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE METHOD
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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13487713
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Filing Dt:
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06/04/2012
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE
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Patent #:
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Issue Dt:
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07/02/2013
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Application #:
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13665295
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Filing Dt:
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10/31/2012
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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13864750
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Filing Dt:
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04/17/2013
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13972292
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Filing Dt:
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08/21/2013
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248-1604 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 W. MADISON ST
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34TH FLOOR
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CHICAGO, IL 60661
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