Patent Assignment Details
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Reel/Frame: | 011431/0327 | |
| Pages: | 3 |
| | Recorded: | 01/10/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09738855
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Filing Dt:
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12/18/2000
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Publication #:
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Pub Dt:
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10/04/2001
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Title:
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Method of producing a multi-layered wiring board
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Assignee
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2-3 MARUNOUCHI 2-CHOME, CHIYODE-KU |
TOKYO, JAPAN 100-8 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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JEFFERY A. WYAND
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700 THIRTEENTH ST N.W.
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SUITE 300
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WASHINGTON, D.C. 20005-3960
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09/22/2024 05:57 PM
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