Patent Assignment Details
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| Reel/Frame: | 015757/0327 | |
| Pages: | 3 |
| | Recorded: | 09/02/2004 | | |
| Attorney Dkt #: | 02887.0261 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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10730903
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Filing Dt:
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12/10/2003
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Publication #:
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Pub Dt:
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06/16/2005
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING FORMING A PATTERN, AN INTERLAYER ISULATION FILM, EXPOSING THE PATTERNING AND FLATTENING
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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LLP
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001-4413
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