Patent Assignment Details
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Reel/Frame: | 030310/0328 | |
| Pages: | 8 |
| | Recorded: | 04/29/2013 | | |
Attorney Dkt #: | GUA-0171-DA-SF |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13775178
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Filing Dt:
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02/23/2013
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Publication #:
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Pub Dt:
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07/25/2013
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Title:
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METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STRUCTURE
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Assignee
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19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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KILE PARK REED & HOUTTEMAN PLLC
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1200 NEW HAMPSHIRE AVE. NW
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SUITE 570
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WASHINGTON, DC 20036
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