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Reel/Frame:	057767/0328			Pages:	9
		Recorded:	10/12/2021
Attorney Dkt #:	48396-700
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 26

Patent #:	7245003	Issue Dt:	07/17/2007	Application #:	10880998	Filing Dt:	06/30/2004
Publication #:	US20060003494	Pub Dt:	01/05/2006
Title:	STACKED PACKAGE ELECTRONIC DEVICE

Patent #:	7183622	Issue Dt:	02/27/2007	Application #:	10882635	Filing Dt:	06/30/2004
Publication #:	US20060001123	Pub Dt:	01/05/2006
Title:	MODULE INTEGRATING MEMS AND PASSIVE COMPONENTS

Patent #:	7705467	Issue Dt:	04/27/2010	Application #:	11769536	Filing Dt:	06/27/2007
Publication #:	US20070278645	Pub Dt:	12/06/2007
Title:	STACKED PACKAGE ELECTRONIC DEVICE

Patent #:	9116238	Issue Dt:	08/25/2015	Application #:	13171070	Filing Dt:	06/28/2011
Publication #:	US20130003502	Pub Dt:	01/03/2013
Title:	CONFIGURABLE ULTRASOUND MEASUREMENT LOGIC IN A MOBILE COMPUTING DEVICE

Patent #:	9061890	Issue Dt:	06/23/2015	Application #:	13798600	Filing Dt:	03/13/2013
Publication #:	US20140264643	Pub Dt:	09/18/2014
Title:	METHODS OF FORMING BURIED ELECTROMECHANICAL STRUCTURES COUPLED WITH DEVICE SUBSTRATES AND STRUCTURES FORMED THEREBY

Patent #:	9490196	Issue Dt:	11/08/2016	Application #:	13977183	Filing Dt:	06/28/2013
Publication #:	US20130277865	Pub Dt:	10/24/2013
Title:	A MULTI DIE PACKAGE HAVING A DIE AND A SPACER LAYER IN A RECESS

Patent #:	NONE	Issue Dt:	11/08/2016	Application #:	13977183	Filing Dt:	06/28/2013
Publication #:	US20130277865	Pub Dt:	10/24/2013			PCT #:	US2011058598
Title:	A MULTI DIE PACKAGE HAVING A DIE AND A SPACER LAYER IN A RECESS

Patent #:	9786581	Issue Dt:	10/10/2017	Application #:	14203415	Filing Dt:	03/10/2014
Publication #:	US20150255372	Pub Dt:	09/10/2015
Title:	THROUGH-SILICON VIA (TSV)-BASED DEVICES AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS

Patent #:	9663353	Issue Dt:	05/30/2017	Application #:	14403571	Filing Dt:	11/24/2014
Publication #:	US20160200566	Pub Dt:	07/14/2016
Title:	MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

Patent #:	NONE	Issue Dt:	05/30/2017	Application #:	14403571	Filing Dt:	11/24/2014
Publication #:	US20160200566	Pub Dt:	07/14/2016			PCT #:	US2013048552
Title:	MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

Patent #:	10204855	Issue Dt:	02/12/2019	Application #:	14653033	Filing Dt:	06/17/2015
Publication #:	US20160284630	Pub Dt:	09/29/2016
Title:	BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

Patent #:	NONE	Issue Dt:	02/12/2019	Application #:	14653033	Filing Dt:	06/17/2015
Publication #:	US20160284630	Pub Dt:	09/29/2016			PCT #:	US2014046395
Title:	BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

Patent #:	NONE	Issue Dt:		Application #:	14733926	Filing Dt:	06/08/2015
Publication #:	US20150266725	Pub Dt:	09/24/2015
Title:	METHODS OF FORMING BURIED ELECTROMECHANICAL STRUCTURES COUPLED WITH DEVICE SUBSTRATES AND STRUCTURES FORMED THEREBY

Patent #:	9735893	Issue Dt:	08/15/2017	Application #:	15216502	Filing Dt:	07/21/2016
Title:	PATCH SYSTEM FOR IN-SITU THERAPEUTIC TREATMENT

Patent #:	10083936	Issue Dt:	09/25/2018	Application #:	15289058	Filing Dt:	10/07/2016
Publication #:	US20170025392	Pub Dt:	01/26/2017
Title:	SEMICONDUCTOR PACKAGE HAVING SPACER LAYER

Patent #:	10150668	Issue Dt:	12/11/2018	Application #:	15484765	Filing Dt:	04/11/2017
Publication #:	US20170217766	Pub Dt:	08/03/2017
Title:	MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

Patent #:	10455308	Issue Dt:	10/22/2019	Application #:	15502495	Filing Dt:	02/07/2017
Publication #:	US20170245035	Pub Dt:	08/24/2017
Title:	DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)

Patent #:	NONE	Issue Dt:	10/22/2019	Application #:	15502495	Filing Dt:	02/07/2017
Publication #:	US20170245035	Pub Dt:	08/24/2017			PCT #:	US2014056133
Title:	DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)

Patent #:	9967040	Issue Dt:	05/08/2018	Application #:	15676611	Filing Dt:	08/14/2017
Publication #:	US20180026730	Pub Dt:	01/25/2018
Title:	PATCH SYSTEM FOR IN-SITU THERAPEUTIC TREATMENT

Patent #:	10403604	Issue Dt:	09/03/2019	Application #:	15766150	Filing Dt:	04/05/2018
Publication #:	US20180294252	Pub Dt:	10/11/2018
Title:	STACKED PACKAGE ASSEMBLY WITH VOLTAGE REFERENCE PLANE

Patent #:	NONE	Issue Dt:	09/03/2019	Application #:	15766150	Filing Dt:	04/05/2018
Publication #:	US20180294252	Pub Dt:	10/11/2018			PCT #:	US2015059191
Title:	STACKED PACKAGE ASSEMBLY WITH VOLTAGE REFERENCE PLANE

Patent #:	10301176	Issue Dt:	05/28/2019	Application #:	15857461	Filing Dt:	12/28/2017
Publication #:	US20180186627	Pub Dt:	07/05/2018
Title:	MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

Patent #:	10636769	Issue Dt:	04/28/2020	Application #:	16127004	Filing Dt:	09/10/2018
Publication #:	US20190006325	Pub Dt:	01/03/2019
Title:	SEMICONDUCTOR PACKAGE HAVING SPACER LAYER

Assignor

Exec Dt:

10/04/2021

Assignee

3600 BRIDGE PARKWAY

SUITE 102

REDWOOD CITY, CALIFORNIA 94065

Correspondence name and address
	WILSON SONSINI GOODRICH & ROSATI
	650 PAGE MILL ROAD
	PALO ALTO, CA 94304

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