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Patent Assignment Details
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Reel/Frame:009022/0329   Pages: 3
Recorded: 02/13/1998
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/10/1999
Application #:
09023254
Filing Dt:
02/13/1998
Title:
DIE ARCHITECTURE ACCOMMODATING HIGH-SPEED SEMICONDUCTOR DEVICES
Assignors
1
Exec Dt:
02/10/1998
2
Exec Dt:
02/10/1998
Assignee
1
MAIL STOP 525
8000 S. FEDERAL WAY
BOISE, IDAHO 83706
Correspondence name and address
MICRON TECHNOLOGY, INC.
CHARLES B. BRANTLEY, II
PATENT DEPT., MAIL STOP 525
8000 S. FEDERAL WAY
BOISE, IDAHO 83706-9632

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