Patent Assignment Details
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| Reel/Frame: | 009384/0330 | |
| Pages: | 3 |
| | Recorded: | 08/10/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2000
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Application #:
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09132127
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Filing Dt:
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08/10/1998
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Title:
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ENCAPSULATION OF SOLDER BUMPS AND SOLDER CONNECTIONS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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JOHN R. PIVNICHNY
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1701 NORTH STREET
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ENDICOTT, NY 13760
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