Patent Assignment Details
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Reel/Frame: | 056170/0332 | |
| Pages: | 5 |
| | Recorded: | 05/07/2021 | | |
Attorney Dkt #: | 00158.0726.00US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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17037051
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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07/08/2021
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Title:
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FORMING METAL PLUG THROUGH A HOLE IN A DEVICE INCLUDING A RESISTANCE LAYER AND CONTACTING EMBEDDED CONDUCTIVE STRUCTURES
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Assignees
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18 ZHANGJIANG ROAD, PUDONG NEW AREA |
SHANGHAI, CHINA 201203 |
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NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT |
BEIJING, CHINA 100716 |
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Correspondence name and address
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ANOVA LAW GROUP C/O SMIC
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21495 RIDGETOP CIRCLE
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SUITE 300
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STERLING, VA 20166
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09/23/2024 02:48 PM
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