Patent Assignment Details
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Reel/Frame: | 056404/0332 | |
| Pages: | 9 |
| | Recorded: | 06/01/2021 | | |
Attorney Dkt #: | 70027-2286 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16005387
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Filing Dt:
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06/11/2018
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Publication #:
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Pub Dt:
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10/11/2018
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4340 STEVENS CREEK BLVD., SUITE 106
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SAN JOSE, CA 95129
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09/22/2024 06:52 PM
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