Patent Assignment Details
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Reel/Frame: | 016090/0333 | |
| Pages: | 2 |
| | Recorded: | 12/15/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11011132
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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Multi-socket circuit board chip bridging device
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Assignee
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INVENTEC BUILDING |
66 HOU-KANG ST., SHIH-LIN DISTRICT |
TAIPEI, TAIWAN R.O.C. |
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Correspondence name and address
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EITAN, PEARL, LATZER & COHEN ZEDEK, LLP.
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10 ROCKEFELLER PLAZA
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SUITE 1001
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NEW YORK, NY 10020
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