Patent Assignment Details
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Reel/Frame: | 010553/0335 | |
| Pages: | 2 |
| | Recorded: | 02/04/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09497669
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Filing Dt:
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02/04/2000
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Title:
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Method of forming a self-aligned contact hole on a semiconductor wafer
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN ROAD 2 |
HSIN-CHU, TAIWAN R.O.C |
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Correspondence name and address
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WINSTON HSU
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3F, NO. 52, LANE 46, MIN-SHEN RD.
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YUNG-HO CITY, TAIPEI HSIEN
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TAIWAN, R.O.C.
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