Patent Assignment Details
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| Reel/Frame: | 062223/0335 | |
| Pages: | 10 |
| | Recorded: | 12/28/2022 | | |
| Attorney Dkt #: | 087611-000054USPX |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18013342
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Filing Dt:
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12/28/2022
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Publication #:
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Pub Dt:
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08/24/2023
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Title:
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SOLAR SILICON WAFER CUTTING METHOD, DEVICE, AND STORAGE MEDIUM
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Assignee
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| OFFICE BUILDING 1, NO. 15, KAIYUAN EAST ROAD, YINCHUAN ECONOMIC DEVELOPMENT ZONE, XIXIA DISTRICT |
| YINCHUAN, NINGXIA, CHINA 750021 |
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Correspondence name and address
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NIXON PEABODY LLP
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799 9TH STREET NW
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SUITE 500
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WASHINGTON, DC 20001
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09/24/2024 12:47 PM
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