Patent Assignment Details
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Reel/Frame: | 014658/0336 | |
| Pages: | 4 |
| | Recorded: | 10/28/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10695564
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Filing Dt:
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10/28/2003
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Title:
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THREE-DIMENSIONAL STACKED SEMICONDUCTOR PACKAGE DEVICE WITH BENT AND FLAT LEADS AND METHOD OF MAKING SAME
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Assignee
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3RD FLOOR, 157 LI-TE ROAD |
PEITOU DISTRICT, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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2440 ANDREW DRIVE
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SUPERIOR, CO 80027
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