Patent Assignment Details
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Reel/Frame: | 056834/0336 | |
| Pages: | 5 |
| | Recorded: | 07/13/2021 | | |
Attorney Dkt #: | 109P000975US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17373876
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Filing Dt:
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07/13/2021
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Publication #:
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Pub Dt:
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01/20/2022
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Title:
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CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD
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Assignee
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2F-5,NO. 611, SEC. 1, WANSHOU RD., GUISHAN DIST., |
TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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09/24/2024 10:05 AM
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