Patent Assignment Details
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Reel/Frame: | 008981/0337 | |
| Pages: | 2 |
| | Recorded: | 02/20/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2000
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Application #:
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08904394
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Filing Dt:
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08/01/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALL OPENINGS IN AN INSULATIVE BASE
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Assignee
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3-19-17 HANNAN-CHO ABENO-KU |
OSAKA, JAPAN 545 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL
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THOMAS S. MACDONALD
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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